The AD7714 is a complete analog front end for low-frequency measurement applications. The device accepts low level signals directly from a transducer and outputs a serial digital word. It employs a sigma-delta conversion technique to realize up to 24 bits of no missing codes performance. The input signal is applied to a proprietary programmable gain front end based around an analog modulator. The modulator output is processed by an on-chip digital filter. The first notch of this digital filter can be programmed via the on-chip control register allowing adjustment of the filter cutoff and settling time.

The part features three differential analog inputs (which can also be configured as five pseudo-differential analog inputs) as well as a differential reference input. The AD7714 thus performs all signal conditioning and conversion for a system consisting of up to five channels. A new Y grade has recently been added to the existing range. Compared to the A grades this new grade has an extended operating temperature range, schmitt trigger inputs on SCLK and DIN, tighter linearity specifications, lower power consumption and is available in a smaller package.

The AD7714 is ideal for use in smart microcontroller- or DSP-based systems. It features a serial interface that can be configured for three-wire operation. Gain settings, signal polarity and channel selection can be configured in software using the serial port. The AD7714 provides self-calibration, system calibration and background calibration options and also allows the user to read and write the on-chip calibration registers.

CMOS construction ensures very low power dissipation, and the power-down mode reduces the standby power consumption to 15 µW typical at 3 V. Minimum operating voltage for the A grades is 3 V and 2.7 V for the Y grades. The A grades are available in a 24-pin, 0.3 inch-wide, plastic dual-in-line package (DIP); a 24 lead small outline (SOIC) package and a 28-lead shrink small outline package (SSOP). The new Y grade is available in a 24-pin, 0.3 inch-wide, plastic dual-in-line package (DIP); a 24 lead small outline (SOIC) package and a 24-lead Thin Shrink Small Outline Package (TSSOP).

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.