Hot Selling IC
Logo
Enter a Part Number:
HMC562-SX picture
Best Price NOW
Manufacturer / Brand: AD
Details: Wideband Driver Amplifier Chip, 2 - 35 GHz IC
Series: HMC562-DIE
Quantity Available: Over 78020 pieces

Datasheet for HMC562-SX:

HMC562-SX datasheet
Price for HMC562-SX
Product Parameters
  • Manufacturer Part Number : HMC562-SX
  • Manufacturer : AD
  • Description : Wideband Driver Amplifier Chip, 2 - 35 GHz IC
  • Series : HMC562-DIE
  • Reference Price : USD 0
  • Our Price : We have a better price, contact us by email
  • Product Type : RF Amplifiers
  • Function : Low Noise Amplifiers
  • Current Suggest : Recommended for New Designs
  • Status : Production
  • ROHS Status : ROHS Compliant (Lead Free)
  • Package Type : CHIPS OR DIE
  • Pins : 0
  • MFG Package Case : X
  • Part Type : OTH
  • Standard Packing Type : Tray
  • Standard Packing Quantity : 2
  • Working Temperature :
  • Other Part Number : HMC562-SX
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for HMC562-SX. If you need any more information about HMC562-SX, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

Request Quotation for HMC562-SX
Part Number (*) Quantity (*) Target Price ($)
Your Contact Information
Company(*) Country(*)
Name(*) Email(*)
Message:
ATTN: You can send us by email: [email protected] (We will reply quickly)
Related IC Components
Features and Benefits of HMC562-SX
Product Detailed Description for HMC562-SX

The HMC562 is a GaAs MMIC PHEMT Distributed Driver Amplifier die which operates between 2 and 35 GHz. The amplifier provides 12.5 dB of gain, +27 dBm output IP3 and +12 dBm of output power at 1 dB gain compression while requiring 80 mA from a +8V supply. The HMC562 is ideal for EW, ECM and radar driver amplifier applications. The HMC562 amplifier I/O’s are DC blocked and internally matched to 50 Ohms facilitating integration into Multi-Chip-Modules (MCMs). All data is taken with the chip connected via two 0.075mm (3 mil) ribbon bonds of minimal length 0.31mm (12 mils).

Applications

  • Military & Space
  • Test Instrumentation
  • Fiber Optics
Lifecycle information of HMC562-SX

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

HMC562-SX More photos
  • QUALITY GUARANTEE
  • FAST DELIVERY
  • BEST PRICE
  • Stocking Distributor for All series AD IC
    Copyright © 2001-2020 BYCHIPS Limited
    bychips.com