Hot Selling IC
Logo
Enter a Part Number:
HMC609-Die picture
Best Price NOW
Manufacturer / Brand: AD
Details: Low Noise Amplifier Chip, 2 - 4 GHz
Series: HMC609-Die
Quantity Available: Over 61360 pieces

Datasheet for HMC609-Die:

HMC609-Die datasheet
Price for HMC609-Die
Product Parameters
  • Manufacturer Part Number : HMC609-Die
  • Manufacturer : AD
  • Description : Low Noise Amplifier Chip, 2 - 4 GHz
  • Series : HMC609-Die
  • Reference Price : USD 0
  • Our Price : We have a better price, contact us by email
  • Product Type : RF Amplifiers
  • Function : Driver Amplifiers
  • Current Suggest : Production
  • Status : Production
  • RoHS Status: -
  • Voltage: -
  • Feature: -
  • Package Case: -
  • Temperature Range: -
  • Packing: Reel/Tray/Tube
  • Standard Packing Quantity: -
  • Country of Origin: -
  • Other Part Number : HMC609-Die
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for HMC609-Die. If you need any more information about HMC609-Die, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

Request Quotation for HMC609-Die
Part Number (*) Quantity (*) Target Price ($)
Your Contact Information
Company(*) Country(*)
Name(*) Email(*)
Message:
ATTN: You can send us by email: [email protected] (We will reply quickly)
Related IC Components
Features and Benefits of HMC609-Die
Product Detailed Description for HMC609-Die
The HMC609 is a GaAs PHEMT MMIC Low Noise Amplifier (LNA) chip which operates from 2 to 4 GHz. The HMC609 features extremely flat performance characteristics including 20dB of small signal gain, 3dB of noise figure and output IP3 of +36 dBm across the operating band. The versatile LNA is ideal for hybrid and MCM assemblies due to its compact size, consistent output power and DC blocked RF I/O's. All data is measured with the chip in a 50 Ohm test fixture connected via one 0.025 mm (1 mil) diameter bondwire of minimal length 0.31 mm (12 mil).


Applications

  • Fixed Microwave
  • Point-to-Multi-Point Radios 
  • Test & Measurement Equipment
  • Radar & Sensors
  • Military & Space
Lifecycle information of HMC609-Die

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

HMC609-Die More photos
  • QUALITY GUARANTEE
  • FAST DELIVERY
  • BEST PRICE
  • Stocking Distributor for All series AD IC
    Copyright © 2001-2020 BYCHIPS Limited
    bychips.com