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Manufacturer / Brand: AD
Details: GaAs, pHEMT, MMIC, 1 W Power Amplifier, 0.1 GHz to 6 GHz IC
Series: HMC637ALP5E
Quantity Available: Over 51720 pieces

Datasheet for HMC637ASCPZ-EP-R7:

HMC637ASCPZ-EP-R7 datasheet
Price for HMC637ASCPZ-EP-R7
Product Parameters
  • Manufacturer Part Number : HMC637ASCPZ-EP-R7
  • Manufacturer : AD
  • Description : GaAs, pHEMT, MMIC, 1 W Power Amplifier, 0.1 GHz to 6 GHz IC
  • Series : HMC637ALP5E
  • Reference Price : USD 0
  • Our Price : We have a better price, contact us by email
  • Product Type : RF Amplifiers
  • Function : Power Amplifiers
  • Current Suggest : Production
  • Status : Production
  • ROHS Status : ROHS Compliant (Lead Free)
  • Package Type : 32-lead LFCSP (5mm x 5mm)
  • Pins : 32
  • MFG Package Case : CP-32-29
  • Part Type : OTH
  • Standard Packing Type : Reel
  • Standard Packing Quantity : 500
  • Working Temperature : -55 to 105C
  • Other Part Number : HMC637ASCPZ-EP-R7
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Features and Benefits of HMC637ASCPZ-EP-R7
  • P1dB output power: 29 dBm
  • Gain: 13 dB
  • Output IP3: 44 dBm
  • 50 Ω matched input/output
  • 32-lead, 5 mm × 5 mm LFCSP package: 25 mm2
Product Detailed Description for HMC637ASCPZ-EP-R7

The HMC637ALP5E is a gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), pseudomorphic high electron mobility transistor (pHEMT) distributed power amplifier which operates between 0.1 GHz and 6 GHz. The amplifier provides 13 dB of gain, 44 dBm output third-order intercept (IP3), and 29 dBm of output power at 1 dB gain compression while requiring 400 mA from a 12 V supply. Gain flatness is ±0.75 dB from 100 MHz to 6 GHz making the HMC637ALP5E ideal for electronic warfare (EW), electronic counter-measure (ECM), radar and test equipment applications. The HMC637ALP5E amplifier radio frequency (RF) I/Os are internally matched to 50 Ω, and the 5 mm × 5 mm lead frame chip scale package (LFCSP) is compatible with high volume surface-mount technology (SMT) assembly equipment.

Applications

  • Telecom infrastructure
  • Microwave radio
  • Very small aperture terminal (VSAT)
  • Military and space
  • Test instrumentation
  • Fiber optics
Lifecycle information of HMC637ASCPZ-EP-R7

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

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