Datasheet for HMC-AUH317:
- Manufacturer Part Number : HMC-AUH317
- Manufacturer : AD
- Description : Medium Power Amplifier Chip, 81 - 86 GHz IC
- Series : HMC-AUH317-DIE
- Reference Price : USD 0
- Our Price : We have a better price, contact us by email
- Product Type : RF Amplifiers
- Function : Driver Amplifiers
- Current Suggest : Recommended for New Designs
- Status : Production
- ROHS Status : ROHS Compliant (Lead Free)
- Package Type : CHIPS OR DIE
- Pins : 0
- MFG Package Case : X
- Part Type : OTH
- Standard Packing Type : Tray
- Standard Packing Quantity : 10
- Working Temperature : 25C
- Other Part Number : HMC-AUH317
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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The HMC-AUH317 is a high dynamic range, three stage GaAs HEMT MMIC Medium Power Amplifier which operates between 81 and 86 GHz. The HMCAUH317 provides 22 dB of gain, and an output power of +17.5 dBm at 1 dB compression from a +4V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.
The HMC-AUH317 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
Applications
- Short Haul / High Capacity Links
- Wireless LAN Bridges
- Military & Space
- E-Band Communication Systems
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.