- Manufacturer Part Number : SSM2211CPZ-REEL
- Manufacturer : AD
- Description : Low Distortion, 1.5 W Audio Power Amplifier IC
- Series : SSM2211
- Reference Price : USD 0.368
- Our Price : We have a better price, contact us by email
- Product Type : Audio Amplifiers
- Function : Class-D Audio Amplifiers
- Current Suggest : Production
- Status : Production
- ROHS Status : ROHS Compliant (Lead Free)
- Package Type : 8-Lead LFCSP (3mm x 3mm w/ EP)
- Pins : 8
- MFG Package Case : CP-8-13
- Part Type : REEL
- Standard Packing Type : Reel
- Standard Packing Quantity : 5000
- Working Temperature : -40 to 85C
- Other Part Number : SSM2211CPZ-REEL
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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The SSM2211 is a high performance audio amplifier that delivers 1 W rms of low distortion audio power into a bridge-connected 8 Ω speaker load (or 1.5 W rms into a 4 Ω load).
The SSM2211 operates over a wide temperature range and is specified for single-supply voltages between 2.7 V and 5.5 V. When operating from batteries, it continues to operate down to 1.75 V. This makes the SSM2211 the best choice for unregulated applications, such as toys and games.
Featuring a 4 MHz bandwidth and distortion below 0.2% total harmonic distortion plus noise (THD + N) at 1 W, superior performance is delivered at higher power or lower speaker load impedance than competitive units. Furthermore, when the ambient temperature is at 25°C, THD + N < 1%, and VS = 5 V on a 4-layer printed circuit board (PCB), the SSM2211 delivers a 1.5 W output.
The low differential dc output voltage results in negligible losses in the speaker winding and makes high value dc blocking capacitors unnecessary. The battery life is extended by using shutdown mode, which typically reduces quiescent current drain to 100 nA.
The SSM2211 is designed to operate over the −40°C to +85°C temperature range. The SSM2211 is available in 8-lead SOIC (narrow body) and LFCSP (lead frame chip scale) surface-mount packages. The advanced mechanical packaging of the LFCSP models ensures lower chip temperature and enhanced performance relative to standard packaging options.
Applications include personal portable computers, hands-free telephones and transceivers, talking toys, intercom systems, and other low voltage audio systems requiring 1 W output power.
Applications
- Portable computers
- Personal wireless communicators
- Hands-free telephones
- Speaker phones
- Intercoms
- Musical toys and talking games
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.