- Manufacturer Part Number : ADG3233BRJZ-REEL7
- Manufacturer : AD
- Description : Low Voltage 1.65 V to 3.6 V, (Up/Down) Logic Level Translation, Bypass Switch IC
- Series : ADG3233
- Reference Price : USD 0.568
- Our Price : We have a better price, contact us by email
- Product Type : Level Translators
- Function : -
- Current Suggest : Production
- Status : Production
- ROHS Status : ROHS Compliant (Lead Free)
- Package Type : 8-Lead SOT-23
- Pins : 8
- MFG Package Case : RJ-8
- Part Type : REEL
- Standard Packing Type : Reel
- Standard Packing Quantity : 3000
- Working Temperature : -40 to 85C
- Other Part Number : ADG3233BRJZ-REEL7
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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- Operates from 1.65 V to 3.6 V Supply Rails
- Bidirectional level translation, unidirectional signal path
- 8-lead SOT-23 and MSOP packages
- Bypass or normal operation
- Short circuit protection
The ADG3233 is a bypass switch designed on a submicron process which operates from supplies as low as1.65 V. The device is guaranteed for operation over the supply range 1.65 V to 3.6 V. It operates from two supplyvoltages allowing bidirectional level translation, that is. it translates low voltages to higher voltages and vice versa.The signal path is unidirectional, meaning data may only flow from A to Y.
This type of device may be used in applications that require a bypassing function. It is ideally suited tobypassing devices in a JTAG chain or bypassing devices in a daisy-chain loop. One switch could be used for eachdevice or a number of devices, thus allowing easy bypassing of one or more devices in a chain. This may beparticularly useful in reducing the time overhead in testing devices in the JTAG chain or in daisy-chain applicationswhere the user does not wish to change the settings of a particular device.
The bypass switch is packaged in two of the smallest footprints available for its required pin count. The 8-leadSOT-23 package requires only 2.9 mm x 2.8 mm board space, while the MSOP package occupies approximately3 mm x 4.9 mm board area.
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.