- Manufacturer Part Number : ADL5802ACPZ-R7
- Manufacturer : AD
- Description : Dual Channel High IP3 100 MHz TO 6 GHz Active Mixer IC
- Series : ADL5802
- Reference Price : USD 6.04
- Our Price : We have a better price, contact us by email
- Product Type : RF Mixers
- Function : Single, Double & Triple Balanced Mixers
- Current Suggest : Recommended for New Designs
- Status : Production
- ROHS Status : ROHS Compliant (Lead Free)
- Package Type : 24-Lead LFCSP (4mm x 4mm w/ EP)
- Pins : 24
- MFG Package Case : CP-24-7
- Part Type : REEL
- Standard Packing Type : Reel
- Standard Packing Quantity : 1500
- Working Temperature : -40 to 85C
- Other Part Number : ADL5802ACPZ-R7
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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- Power conversion gain of 1.6 dB
- Wideband RF, LO, and IF ports
- SSB noise figure of 11 dB
- Input IP3 of 28 dBm
- Input P1dB of 12 dBm
- Typical LO drive of 0 dBm
- Low LO leakage
- Single supply operation: 5 V @
240 mA - Exposed paddle, 4 mm × 4 mm,
24-lead LFCSP package
The ADL5802 uses high linearity, double-balanced, active mixer cores with integrated LO buffer amplifiers to provide high dynamic range frequency conversion from 100 MHz to 6 GHz. The mixers benefit from a proprietary linearization architecture that provides enhanced input IP3 performance when subject to high input levels. A bias adjust feature allows the input linearity, SSB noise figure, and dc current to be optimized using a single control pin. The high input linearity allows the device to be used in demanding cellular applications where in-band blocking signals may otherwise result in degradation in dynamic performance. The balanced active mixer arrangement provides superb LO to RF and LO to IF leakage, typically better than −30 dBm.
The IF outputs are designed for a 200 Ω source impedance and provide a typical voltage conversion gain of 7.6 dB when loaded into a 200 Ω load.
The ADL5802 is fabricated using a SiGe high performance IC process. The device is available in a compact 4 mm × 4 mm, 24-lead LFCSP package and operates over a −40°C to +85°C temperature range. An evaluation board is also available.
Applications
Data Sheet, Rev 0, 11/2009
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.