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Manufacturer / Brand: AD
Details: E-Band I/Q Downconverter, 81 GHz to 86 GHz IC
Series: HMC7587
Quantity Available: Over 50080 pieces

Datasheet for HMC7587:

HMC7587 datasheet
Price for HMC7587
Product Parameters
  • Manufacturer Part Number : HMC7587
  • Manufacturer : AD
  • Description : E-Band I/Q Downconverter, 81 GHz to 86 GHz IC
  • Series : HMC7587
  • Reference Price : USD 0
  • Our Price : We have a better price, contact us by email
  • Product Type : RF Mixers
  • Function : I/Q Downconverters/Receivers
  • Current Suggest : Recommended for New Designs
  • Status : Production
  • ROHS Status : ROHS Compliant (Lead Free)
  • Package Type : CHIPS OR DIE
  • Pins : 0
  • MFG Package Case : C-40-1
  • Part Type : OTH
  • Standard Packing Type : Tray
  • Standard Packing Quantity : 25
  • Working Temperature : -55 to 85C
  • Other Part Number : HMC7587
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

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Features and Benefits of HMC7587
Product Detailed Description for HMC7587

The HMC7587 is an integrated, E-band gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), in-phase/quadrature (I/Q) downconverter chip that operates from 81 GHz to 86 GHz. The HMC7587 provides a small signal con-version gain of 10 dB with 30 dBc of sideband rejection across the frequency band. The device uses a low noise amplifier followed by an image rejection mixer that is driven by a 6× multiplier.

The image rejection mixer eliminates the need for a filter following the low noise amplifier. Differential I and Q mixer outputs are provided for direct conversion applications. Alternatively, the outputs can be combined using an external 90° hybrid and two external 180° hybrids to allow for single-sideband applications. All data includes the effect of a 3 mm wide ribbon wedge bond on the RF port, and a 1 mm gold wire wedge bond on the intermediate frequency (IF) ports.

Applications 

  • E-band communication systems 
  • High capacity wireless backhauls 
  • Test and measurement 
Lifecycle information of HMC7587

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

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