Datasheet for HMC-XDB112:
- Manufacturer Part Number : HMC-XDB112
- Manufacturer : AD
- Description : x2 Passive Frequency Multiplier Chip, 20 - 30 GHz Output IC
- Series : HMC-XDB112
- Reference Price : USD 0
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- Product Type : Frequency Dividers, Multipliers, & Detectors
- Function : Frequency Multipliers
- Current Suggest : Recommended for New Designs
- Status : Production
- ROHS Status : ROHS Compliant (Lead Free)
- Package Type : CHIPS OR DIE
- Pins : 0
- MFG Package Case : X
- Part Type : OTH
- Standard Packing Type : Tray
- Standard Packing Quantity : 25
- Working Temperature : 25C
- Other Part Number : HMC-XDB112
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : 0.001KG
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- Conversion Loss: 13 dB
- Passive: No DC Bias Required
- Input Drive: +13 dBm
- High Fo Isolation: 30 dB
- Die Size: 2.2 x 0.65 x 0.1 mm
The HMC-XDB112 is a monolithic Passive Frequency Doubler which utilizes GaAs Heterojunction Bipolar Transistor (HBT) technology, and is targeted to high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation.
The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
Applications
- Point-to-Point Radios
- VSAT
- Test Instrumentation
- Military & Space
- Clock Generation
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.