Hot Selling IC
Logo
Enter a Part Number:
HMC-XTB110 picture
Best Price NOW
Manufacturer / Brand: AD
Details: Passive x3 Frequency Multiplier, 24 - 30 GHz Input IC
Series: HMC-XTB110
Quantity Available: Over 23130 pieces

Datasheet for HMC-XTB110:

HMC-XTB110 datasheet
Price for HMC-XTB110
Product Parameters
  • Manufacturer Part Number : HMC-XTB110
  • Manufacturer : AD
  • Description : Passive x3 Frequency Multiplier, 24 - 30 GHz Input IC
  • Series : HMC-XTB110
  • Reference Price : USD 0
  • Our Price : We have a better price, contact us by email
  • Product Type : Frequency Dividers, Multipliers, & Detectors
  • Function : Frequency Multipliers
  • Current Suggest : Recommended for New Designs
  • Status : Production
  • ROHS Status : ROHS Compliant (Lead Free)
  • Package Type : CHIPS OR DIE
  • Pins : 0
  • MFG Package Case : X
  • Part Type : OTH
  • Standard Packing Type : Tray
  • Standard Packing Quantity : 50
  • Working Temperature : -55 to 85C
  • Other Part Number : HMC-XTB110
  • Shipping methods : DHL FEDEX UPS TNT
  • Delivery Time : Ship within 1 day.
  • Manufacturer Production time : 6-8 weeks (Normally have stocks)
  • Weight : 0.001KG

Contact us to check the best price and real time inventory quantity for HMC-XTB110. If you need any more information about HMC-XTB110, you can also send us by email. Our email is [email protected], we will reply you in 12 hours.

Request Quotation for HMC-XTB110
Part Number (*) Quantity (*) Target Price ($)
Your Contact Information
Company(*) Country(*)
Name(*) Email(*)
Message:
ATTN: You can send us by email: [email protected] (We will reply quickly)
Related IC Components
Features and Benefits of HMC-XTB110
  • Conversion Loss: 19 dB
  • Input Drive: +13 dBm
  • Passive: No DC Bias Required
  • Die Size: 1.1 x 1.4 x 0.1 mm
Product Detailed Description for HMC-XTB110

The HMC-XTB110 is a monolithic x3 Passive Frequency Multiplier which utilizes GaAs Shottky Diode technology, and exhibits low conversion loss and high Fo isolation. This wideband x3 multiplier requires no DC power, and is targeted to high volume applications where frequency x3 of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized. The HMC-XTB110 Passive x3 MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

Applications

  • E-Band Communication Systems

  • Short-Haul / High Capacity Radios

  • Automotive Radar

  • Test & Measurement Equipment

  • SATCOM

Lifecycle information of HMC-XTB110

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

HMC-XTB110 More photos
  • QUALITY GUARANTEE
  • FAST DELIVERY
  • BEST PRICE
  • Stocking Distributor for All series AD IC
    Copyright © 2001-2020 BYCHIPS Limited
    bychips.com